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CONFORMALLY ENCAPSULATED MULTI-ELECTRODE ARRAYS WITH SEAMLESS INSULATION
专利权人:
Phillipe J. Tabada
发明人:
Phillipe J. Tabada,Satinderpall S. Pannu,Kedar G. Shah,Vanessa Tolosa,Angela Tooker,Terri Delima,Heeral Sheth,Sarah Felix
申请号:
US15298140
公开号:
US20170036012A1
申请日:
2016.10.19
申请国别(地区):
US
年份:
2017
代理人:
摘要:
Thin-film multi-electrode arrays (MEA) having one or more electrically conductive beams conformally encapsulated in a seamless block of electrically insulating material, and methods of fabricating such MEAs using reproducible, microfabrication processes. One or more electrically conductive traces are formed on scaffold material that is subsequently removed to suspend the traces over a substrate by support portions of the trace beam in contact with the substrate. By encapsulating the suspended traces, either individually or together, with a single continuous layer of an electrically insulating material, a seamless block of electrically insulating material is formed that conforms to the shape of the trace beam structure, including any trace backings which provide suspension support. Electrical contacts, electrodes, or leads of the traces are exposed from the encapsulated trace beam structure by removing the substrate.
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中国工程科技知识中心
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