A process according to one embodiment includes milling a media facing surface of a module having an array of sensors at a first angle, and milling the media facing surface of the magnetic head module at a second angle, not necessarily in that order. After the milling at the first and second angles, the media facing surface of the module is milled at a third angle between 55 degrees and 65 degrees from normal. An apparatus according to one embodiment includes a tape head module having an array of at least eight current perpendicular to plane sensors, wherein none of the sensors has a resistance more than about 10% away from the resistances of its nearest neighbors.
