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FUSE PRODUCTION METHOD, FUSE, CIRCUIT BOARD PRODUCTION METHOD AND CIRCUIT BOARD
专利权人:
SOC Corporation
发明人:
OGAWA, Toshitaka
申请号:
EP20150888451
公开号:
EP3282467(A1)
申请日:
2015.04.07
申请国别(地区):
欧洲专利局
年份:
2018
代理人:
摘要:
[Problem] To produce a fuse whose fuse film is resistant to being peeled from a substrate at a low cost. [Means to solve the problem] A fuse production method includes the steps of forming an ink film 110 of a dispersion liquid, in which metal nanoparticles are dispersed in a solvent, on a surface 102 of a substrate 100 containing at least an organic substance (step S102), heating the ink film 110 so as to vaporize the solvent to melt or sinter the metal nanoparticles and to soften or melt the surface 102 (step S138), and forming a fuse film 120 on the surface 102 by fusing the melted or sintered metal nanoparticles and the softened or melted principal surface with each other (step S140).
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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