Short Jr., Byron Elliott,Francis, Nathan R.,Brandt, David B.
申请号：
AU20160387357
公开号：
AU2016387357(A1)
申请日:
2016.11.18
申请国别(地区):
澳大利亚
年份:
2018
代理人:
摘要：
One or both of a module cover (102) and a heat sink (103) for a circuit card module (100) includes a multi-level cooling structure (300) formed by a body (301), sidewalls (302) extending from edges of the body and, together with the body, partially enclosing a volume, flanges (303) projecting from ends of the sidewalls opposite the body and away from the volume, and an oscillating heat pipe (304) within the body, the sidewalls, and the flanges. The oscillating heat pipe fluid path repeatedly traverses the body, a length of each of the sidewalls, and a portion of each of the flanges. The oscillating heat pipe provides cooling through both phase change of fluid slugs and vapor bubbles within the oscillating heat pipe and movement of the fluid slugs and the vapor bubbles along the fluid path between an evaporator (308) adjacent a first of the flanges and a condenser (309) adjacent a second of the flanges.
