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FUSE PRODUCTION METHOD, FUSE, CIRCUIT BOARD PRODUCTION METHOD AND CIRCUIT BOARD
专利权人:
SOC Corporation
发明人:
OGAWA Toshitaka
申请号:
US201715726373
公开号:
US2018033578(A1)
申请日:
2017.10.05
申请国别(地区):
美国
年份:
2018
代理人:
摘要:
A fuse production method includes the steps of forming a liquid film of a dispersion liquid, in which metal nanoparticles are dispersed in a solvent, on a principal surface of a substrate containing at least an organic substance, heating the liquid film so as to vaporize the solvent to melt or sinter the metal nanoparticles and to soften or melt the principal surface, and forming a fuse film on the principal surface by fusing the melted or sintered metal nanoparticles and the softened or melted principal surface with each other.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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