A die processing machine (100) for processing a workpiece (190) comprises (a) a first platen (110); (b) a second platen (115); (c) a lifting system (120) for providing a relative movement between the two platens (110, 115) along a predeterm ined direction (z); (d) a die processing tool (130) being located in between the two platens (110, 115) and being mechanically connected with the first platen (110), wherein the die processing tool (130) comprises at least two dies (132); (e) a back plate (140) being mechanically connected with the second platen, wherein a workpiece (190) is insertable in between the back plate (140) and the die processing tool (130); (f) a compensation element (150) being located in between the first platen (110) and the die processing tool (130) for providing an appropriate leveling of the at least two dies; (g) a mechanical action sensor (160) being non-detachably located in between the two platens and providing mechanical action data signals which are indicative for mechanical actions
