The disclosure discloses a device for terminal heat dissipation and a mobile terminal, including: a heat source chip, a heat pipe, and a shield, wherein the shield is located between the heat source chip and the heat pipe, and is connected with the heat source chip and with the heat pipe via the same type of flexible thermal conductive solid; and a microporous array is arranged at a connection position between the flexible thermal conductive solids, which are in contact with the shield. By means of the disclosure, the problem in the related art that heat cannot be quickly conducted to the heat pipe due to the back-and-forth conversion of the conductive medium in the thermal conductive path is solved, and heat can therefore be quickly conducted to the heat pipe, speeding up an effect of heat dissipation.
