To provide a resin composition that contains a solvent-soluble polyimide and can provide a film exhibiting high viscoelasticity and flexibility at high temperatures. To attain this, a polyimide resin composition is provided that includes a polyimide having a polycondensation unit of a tetracarboxylic acid dianhydride and a diamine, wherein the tetracarboxylic acid dianhydride includes an (±1) tetracarboxylic acid dianhydride represented by general formula (1), or the diamine includes an (²1) aromatic diamine represented by general formula (2), the diamine includes an (²2) aliphatic diamine represented by general formula (3) or (4), a total amout of the (±1) tetracarboxylic acid dianhydride and the (²1) aromatic diamine is 5 to 49 mol% with respect to a total amount of the tetracarboxylic acid dianhydride and the diamine, and an amine equivalent of the polyimide is 4,000 to 20,000.
