An ultrasound device is described. The ultrasound device may include a cavity, a membrane, and a sensing electrode. When an electrical signal is applied to the sensing electrode and a static bias is applied to the membrane, the membrane vibrates within the cavity and produces ultrasonic signals. The cavity, the membrane, and the sensing electrode may be considered a capacitive micromachined ultrasonic transducer (CMUT). The sensing electrode may be shaped as a ring, whereby the central portion of the sensing electrode is removed. Removal of the central portion of the sensing electrode may reduce the parasitic capacitance without substantially affecting the production of ultrasonic signals by the CMUT. This, in turn, can result in an increase in the signal-to-noise ratio (SNR) of the ultrasonic signals. The ultrasound device may further include a bond pad configured for wire bonding, and a trench electrically isolating the bond pad from the membrane.一種超音波裝置被描述。該超音波裝置可包含一腔室、一薄膜、以及一感測電極。當一電性信號被施加至該感測電極並且一靜態偏壓被施加至該薄膜時，該薄膜係在該腔室之內振動，並且產生超音波信號。該腔室、薄膜、以及感測電極可被視為一電容式微加工超音波換能器(CMUT)。該感測電極可被塑形為一環，因而該感測電極的中央部分係被移除。該感測電極的中央部分的移除可以降低寄生電容，而不實質影響藉由該CMUT的超音波信號的產生。於是，此可以導致在該些超音波信號的信號雜訊比(SNR)上的一增加。該超音波裝置可以進一步包含一被配置以用於引線接合的焊墊、以及一電性隔離該焊墊與該薄膜的溝槽。
