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ULTRASONIC DEVICE, METHOD FOR MANUFACTURING THE SAME, ELECTRONIC DEVICE AND ULTRASONIC IMAGING DEVICE
专利权人:
SEIKO EPSON CORPORATION
发明人:
Kanechika KIYOSE
申请号:
US15729951
公开号:
US20180047891A1
申请日:
2017.10.11
申请国别(地区):
US
年份:
2018
代理人:
摘要:
An ultrasonic device includes a substrate having a first opening, a second opening and a wall part partitioning the first opening and the second opening; a first vibration film and a second vibration film which close the first opening and the second opening respectively; a first piezoelectric element and a second piezoelectric element which are formed on surfaces of the first vibration film and the second vibration film opposite to the substrate; an acoustic matching layer which is disposed within the first opening and the second opening so as to come into contact with the first vibration film and the second vibration film.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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