Thermal management for light-emitting diodes

• 收藏
• 分享

专利权人:

INTEL CORPORATION

发明人:

Shah Ketan R.,Halton Sean M.

申请号：

US201113977400

公开号：

US9657931(B2)

申请日:

2011.12.21

申请国别(地区):

美国

年份:

2017

代理人:

摘要：

Embodiments of the invention provide lighting systems that employ light-emitting diode (LED) chips as active lighting elements. Heat management components for the LED chips employed in the lighting sources are provided. In embodiments of the invention, LED chips are cooled by one or more heatspreaders and heat sinks attached to a substrate that houses the LED chip and/or the topside of the LED chip.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/