An integrated circuit test device includes a carrying base with a probe station installed thereon, a clamping and positioning mechanism and a cover plate. The clamping and positioning mechanism includes a lower base, an elastic piece, an upper base and a pair of elastic arms. The lower base is arranged corresponding to the probe station. The elastic piece is elastically clamped between the probe station and the lower base. The upper base is stacked on the lower case and disposed with a chip socket. The pair of elastic arms is movably arranged in the chip socket. The cover plate is fixed to the carrying base. The cover plate is disposed with an opening corresponding to the chip socket. A sliding structure (A) is disposed between the pair of elastic arms and the cover plate for enabling the pair of elastic arms to clamp and fix the integrated circuit.
