Provided are: a material for printed circuit boards which resists warping at high temperature (150-200°C) while maintaining electrical properties; a metal laminate; a method for manufacturing the same; and a method for manufacturing a printed circuit board. A material having a fluorine-containing resin layer is subjected to a heat treatment. The fluorine-containing resin layer comprises a composition containing a fluorine-containing copolymer (a) which has at least one functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group, and an isocyanate group, has a melting point of 280-320°C, and has a melt flow rate of at least 2 g per 10 minutes as measured under a load of 49 N at 372°C. The heat treatment is performed at a temperature which is equal to or higher than 250°C but lower than the melting point of the fluorine-containing copolymer (a) by at least 5°C such that the ratio of the melt flow rates of the fluorine-containing resin layer befo
