REARWARD ACOUSTIC DIFFUSION FOR ULTRASOUND-ON-A-CHIP TRANSDUCER ARRAY

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专利权人:

Inc.;Butterfly Network

发明人:

Matthew R. Hageman,Christopher Thomas McNulty

申请号：

US15223550

公开号：

US20180028159A1

申请日:

2016.07.29

申请国别(地区):

US

年份:

2018

代理人:

摘要：

A heat sink device has a non-planar mounting surface and an ultrasonic transducer substrate attached to the non-planar mounting surface. The non-planar mounting surface of the heat sink device is configured to diffuse acoustic waves that are incident thereupon.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/