An endoscope apparatus is configured such that a heat absorbing section 55 is disposed to cover heat sources 42, 43, 45, 46 of an electronic image pickup unit 30 which is disposed in a distal end portion 11 to absorb heat generated by the heat sources 42, 43, 45, 46, the heat is transferred by a heat transfer section 52, the transferred heat is radiated by a heat radiation section 51 to heat an observation window 22 disposed at the distal end portion 11, to thereby suppress electric noises of picked up images as well as prevent fogging on an outer surface of an optical member disposed at the distal end of the insertion portion.