A through silicon via chip and manufacturing method thereof are provided, where the through silicon via chip includes a silicon substrate (210), the silicon substrate (210) is provided with a via (220), the via (220) is an oblique via, and a backfill structure layer (230) is disposed in the via (220). According to the through silicon via chip and manufacturing method thereof, a fingerprint identification sensor and a terminal device, a backfill structure is added in an oblique via to play a supportive role when a force is exerted on a surface of the through silicon via chip, which avoids a fracture of the through silicon via chip, thereby enhancing structural strength of the through silicon via chip.
