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THREE DIMENSIONAL BINDING SITE ARRAY FOR INTERFERING WITH AN ELECTRICAL FIELD
专利权人:
BIOTRONIC SYSTEMS CORPORATION
发明人:
STANBRO, WILLIAM D.
申请号:
US19870044761
公开号:
US5082627(A)
申请日:
1987.05.01
申请国别(地区):
美国
年份:
1992
代理人:
摘要:
A dielectric material of a capacitive affinity sensor has a three-dimensional molecular binding site array. A glass base is layered with a binding agent like silane from which a polymeric backbone like polylysine extends. The polymeric backbone is prepared to accept receptor molecules like cortisol hemisuccinate to bind a specific antibody. Such an array changes dielectric properties between the two electrodes of the capacitive affinity sensor to greatly enhance sensitivity of the sensor.
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