A solution for testing a set of one or more electronic device (105) is disclosed. A corresponding test board (100) comprises a support substrate (205), a set of one of more sockets (210) being mounted on the support substrate each one for housing an electronic device (105) to be tested with a main surface thereof facing the support substrate, for each socket a thermal conditioning element (235) for acting on the main surface of the electronic device, and for each socket biasing means (240) being switchable between an active condition, wherein the biasing means biases the thermal conditioning element in contact with the main surface of the electronic device, and a passive condition, wherein the biasing means maintains the thermal conditioning element separate from the main surface of the electronic device.
