AMOREPACIFIC CORPORATION;MASSACHUSETTS INSTITUTE OF TECHNOLOGY
发明人:
Jiyeon HAN,Han-Wool YEUN,Eunjoo KIM,Jeehwan KIM
申请号：
US16223623
公开号：
US20200187858A1
申请日:
2018.12.18
申请国别(地区):
US
年份:
2020
代理人:
摘要：
Exemplary embodiments relate to a skin-adherable flexible patch including a flexible patch layer having one surface that can adhere to skin and configured to support a micro scale semiconductor device； and a plurality of holes passing through from one surface of the flexible patch to the other surface of the flexible patch, and a method for manufacturing the flexible patch.
