An apparatus having a spring plate connecting with 3D circuit terminals comprises a base having a top surface and a thickness surface. At least one bulged plane is formed on a predetermined location of the top surface. A side surface of the bulged plane is declined from inside to outside. At least one extending end is formed on the thickness surface of the base, by corresponding to and extending toward a direction opposite to the bulged plane. A declined surface is formed on an outer side of the extending end, by extending and declining from top to bottom and also from inside to outside. At least one metal layer is formed on the bulged plane and the declined surface by means of 3D electroplating in order to form a circuit connecting the terminals and the spring plate.
