SCHÖWEL, Michael,HELBIG, Peter,SZÉKELY, József,SEIFRITZ, Sven
申请号：
WO2016EP61091
公开号：
WO2017001108(A1)
申请日:
2016.05.18
申请国别(地区):
世界知识产权组织国际局
年份:
2017
代理人:
摘要：
The invention relates to a circuit support for an electronic circuit, comprising: - at least one conductor path (22); - an insulating matrix made of a first insulating material (17) that is injection-molded over the at least one conductor path (22) in such a way as to leave open at least one first region (15) for connecting at least one electronic component (14) of the electronic circuit; - and a heat sink (18); the first insulating material (17) is injection-molded over the at least one conductor path (22) in such a way that the insulating matrix (16) also leaves open at least one second region (34) located between the conductor path (22) and the heat sink (18); the circuit support further comprises a plurality of spacers (28; 36) which are designed and placed in such a way as to adjust a height (h1) of the second region (34) between the conductor path (22) and the heat sink (18); the circuit support also comprises a second insulating material (24) with which the second region (34) is filled. The invention f
