GAS COOLED SUBSTRATE SUPPORT FOR STABILIZED HIGH TEMPERATURE DEPOSITION

• 收藏
• 分享

专利权人:

Applied Materials, Inc.

发明人:

WEST Brian,COX Michael S.,OH Jeonghoon

申请号：

US201715784972

公开号：

US2018037987(A1)

申请日:

2017.10.16

申请国别(地区):

美国

年份:

2018

代理人:

摘要：

Embodiments of the present disclosure provides apparatus and method for stabilizing substrate temperature by flowing a flow of cooling gas to an inlet of cooling channels in a substrate support, receiving the flow of cooling gas from an outlet of the cooling channel using a heat exchanger, and releasing the cooling gas to an immediate environment, such as a cleanroom or a minienvironment.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/