A solvent-free polyimide silicone resin composition, and a cured product thereof, includes (A) a polyimide silicone resin having recurring units having a specific type of structure and having a weight average molecular weight of 5,000 to 150,000, (B) an epoxy resin, and (C) an epoxy resin curing agent wherein the resin composition having a fluidity at 25°C and is free of a solvent.