JUN, Kimin,JENSEN, Jacob M.,MORROW, Patrick,FISCHER, Paul B.
申请号：
WO2015US38156
公开号：
WO2016209294(A1)
申请日:
2015.06.26
申请国别(地区):
世界知识产权组织国际局
年份:
2016
代理人:
摘要：
A method including coupling a device substrate to a carrier substrate; aligning a portion of the device substrate to a host substrate; separating the portion of the device substrate from the carrier substrate; and after separating the portion of the device substrate, coupling the portion of the device substrate to the host substrate. A method including coupling a device substrate to a carrier substrate with an adhesive between a device side of the device substrate and the carrier substrate; after coupling the device substrate to the carrier substrate, thinning the device substrate; aligning a portion of the thinned device substrate to a host substrate; separating the portion of the device substrate from the carrier substrate; and coupling the separated portion of the device substrate to the host substrate. An apparatus including a substrate including a submicron thickness and a device layer coupled to a host substrate in a stacked arrangement.
