A method for manufacturing a plurality of die pairs includes providing a first wafer including a plurality of spaced apart first dies arranged in a first array including a first, first die row and a second, first die row spaced apart by a first portion of a first row channel; providing a second wafer including a plurality of spaced apart second dies arranged in a second array including a first, second die row and a second, second die row spaced apart by a second portion of the first row channel; connecting the first wafer to the second wafer with a connector assembly to form a wafer pair such that the first dies and the second dies cooperate to form the plurality of die pairs; positioning a first support assembly between the first wafer and the second wafer to rigidly support the first wafer relative to the second wafer; and cutting along the first row channel with a blade to separate the plurality of die pairs from one another.
