PROBLEM TO BE SOLVED: To provide an assembly method of a curved chip based non-planar device and an apparatus for assembly.SOLUTION: A groove hole is prepared as an opening in a longitudinal direction in a chip, a flexural stress is decreased, and an allowable deformation degree of the chip is improved. The chip is deformed in a desired shape within the allowable deformation degree via the groove hole, retention holding is given to at least a part of the chip, and the chip is kept curved in accordance with the desired deformation. Further, a non-planar integrated circuit device is also described which comprises a flexible structure and at least one stationary structure that is coupled thereto. The flexible structure is curved in a desired shape. A plurality of contact regions are included in the flexible structure. A circuit is integrated in the flexible structure and performs a processing operation.SELECTED DRAWING: Figure 3ACOPYRIGHT: (C)2017,JPO&INPIT【課題】湾曲チップベースの非平面デバイスの組立方法及び組立用装置を記載する。【解決手段】溝穴が、チップに縦方向の開口部として作成され、曲げ応力を減少させて、前記チップの許容し得る変形度を高める。前記チップは、前記溝穴を介して前記許容し得る変形度内で所望の形に変形され、前記チップの少なくとも一部に拘束の保持を与え、前記チップを前記所望の変形に応じて湾曲させたままにする。また、可撓性構造とそれに結合する少なくとも1つの固定構造を備える非平面(non-planner)集積回路デバイスも記載される。前記可撓性構造は、所望の形に湾曲される。複数の接触領域が、前記可撓性構造に備えられる。回路が、前記可撓性構造に組み込まれて処理操作を行う。【選択図】図3A
