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Non-planar wafers structure fills
专利权人:
이리듐 메디칼 테크놀로지 컴퍼니 리미티드
发明人:
팬, 롱-쉥
申请号:
KR1020177022307
公开号:
KR1019129280000B1
申请日:
2011.12.08
申请国别(地区):
KR
年份:
2018
代理人:
摘要:
Method and apparatus,Non-planar for component is described based on curved chip. Slot can be rich to reduce bending stress because of longitudinal opening, to increase the chip of the degree of deformation allowed. The chip can be deformed into desired deformation and pass through slot in the degree of deformation of permission. Constraint is kept to can be set curved according to desired deformation to remain to allow chip at least part chip. Unplanned device integrated circuit device includes that at least one fixture structure is adhered to flexible structure, which is also described. Flexible structure can curve desired deformation. Multiple contact areas may include in flexible structure. Circuit can be embedded in flexible structure and execute processing operation.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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