您的位置: 首页 > 农业专利 > 详情页

Light source device having multiple LED chips of different thickness
专利权人:
Genesis Photonics Inc.
发明人:
Chen Cheng-Yen,Li Yun-Li,Su Po-Jen
申请号:
US201514886110
公开号:
US9748209(B2)
申请日:
2015.10.19
申请国别(地区):
美国
年份:
2017
代理人:
Jianq Chyun IP Office
摘要:
A light source device including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. Each of the first LED chips includes a first chip substrate, a first semiconductor layer, and a plurality of first electrodes, and the first electrodes are disposed on the upper surface of the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. The second LED chip includes a second chip substrate, a second semiconductor layer, and a plurality of second electrodes. A thickness of the second chip substrate is different from than a thickness of the first chip substrate, and the second electrodes are disposed on the upper surface of the substrate.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

意 见 箱

匿名:登录

个人用户登录

找回密码

第三方账号登录

忘记密码

个人用户注册

必须为有效邮箱
6~16位数字与字母组合
6~16位数字与字母组合
请输入正确的手机号码

信息补充