SPANOS, Konstantin,DAVES, Walter,SCHWAIGER, Stephan
申请号：
EP20160710119
公开号：
EP3292566(A1)
申请日:
2016.03.08
申请国别(地区):
欧洲专利局
年份:
2018
代理人:
摘要：
The invention relates to a method for producing an electronic circuit device (200). The method comprises a step of providing a substrate (202) and a step of processing a III-V-connection semiconductor circuit (206) on a substrate top side (204) of the substrate (202), wherein the III-V-connection semiconductor circuit (206) has at least one III-V-connection semiconductor component (208), a second III-V-connection semiconductor component (210), and an electrical conductor (212), which electrically conductively connects the first III-V connection semiconductor component (208) and the second III-V connection semiconductor component (210). In an arranging step, a metal layer or a metallized interconnect device is arranged on a rear side of the substrate, opposite the substrate top side, as an electrical contact surface for refeeding a current for a power electronic circuit.
