Provided is a molded interconnect device, a manufacturing method for a molded interconnect device, and a circuit module, including a lead which can be easily manufactured while keeping product precision even when downsized and can be connected to an external substrate. A molded interconnect device 10 according to the present invention is the molded interconnect device 10 adapted to form a three-dimensional circuit by using laser beams and including: a main body 1 on which the three-dimensional circuit is formed; and a lead portion 2 connected to an external electrode of an external substrate by solder, and extending from the main body 1, wherein the lead portion 2 includes a lead main body molded from a material same as that of the main body 1 and a metal film formed on at least a part of an outer periphery of the lead main body.
