An environmental sensitive electronic device package having side wall barrier structure may include a first package substrate, a second package substrate, a carrier substrate, an environmental sensitive electronic device, at least one side wall barrier structure and an adhesive. The second package substrate is located above the first package substrate. The carrier substrate is located above the first package substrate and between the first package substrate and the second package substrate. The environmental sensitive electronic device is located on the carrier substrate and between the carrier substrate and the second package substrate. The at least one side wall barrier structure is located between the first package substrate and the second package substrate. At least one portion of the at least one side wall barrier structure surrounds the environmental sensitive electronic device. The adhesive is located between the first package substrate and the second package substrate, and the adhesive covers the carr
