MICROELECTROMECHANICAL SYSTEM (MEMS) BOND RELEASE STRUCTURE AND METHOD OF WAFER TRANSFER FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D IC) INTEGRATION

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专利权人:

QUALCOMM INCORPORATED

发明人:

LAN, JE-HSIUNG JEFFREY,ZHANG, WENYUE,DU, YANG,LEE, YONG JU,GU, SHIQUN,XIE, JING

申请号：

SG11201700918R

公开号：

SG11201700918R(A)

申请日:

2015.09.08

申请国别(地区):

新加坡

年份:

2017

代理人:

摘要：

A microelectromechanical system (MEMS) bond release structure is provided for manufacturing of three-dimensional integrated circuit (3D IC) devices with two or more tiers. The MEMS bond release structure includes a MEMS sacrificial release layer which may have a pillar or post structure, or alternatively, a continuous sacrificial layer for bonding and release.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/