This positive dry film resist having a resist layer on a temporary supporting body and satisfying condition (1) and/or condition (2) enables manufacturing of circuit wiring having high pattern linearity. Condition (1): the temporary supporting body has a transmittance of not higher than 80% with respect to an exposure main wavelength for the resist layer. Condition (2): a light absorption layer having a transmittance of not higher than 80% with respect to the exposure main wavelength for the resist layer is included between the temporary supporting body and the resist layer. Also provided are a manufacturing method for circuit wiring, circuit wiring, an input device, and a display device.
