A kind of encapsulating structure of bendable chipset,It is include a chipset,The chipset includes that the chip that number is alternatively arranged and one fix film,And the grade chips are coated and fixed in the fixation membrane system,Its pre-position of fixation film what at least provided with a bending part,Make the fixation film that there is the flexibility of predetermined direction,Thereby,Bend the encapsulating structure of the bendable chipset for bending,Be with when user dresses the bendable chipset,The activity of user will not be thus restricted,And can completely smooth what human body surface,The comfort of wearing is promoted,When the chip more being made to radiate far-infrared ray power,Preferably effect can be generated.一種可撓式晶片組之封裝結構，其係包含有一晶片組，該晶片組包含有數間隔排列之晶片及一固定膜，而該固定膜係包覆固定該等晶片，該固定膜於其預定位置處至少設有一彎折部，使該固定膜具有預定方向之撓曲性，藉此，使該可撓式晶片組之封裝結構可供彎折撓曲，是以當使用者穿戴該可撓式晶片組時，使用者的活動將不因而受到限制，且可完全平貼於人體表面，提升穿戴的舒適性，更使該晶片放射遠紅外線能量時，能產生較佳之效果。
