A kind of encapsulating structure of chip and cloth,It is include a base fabric and number chipset,And the equal chips system penetrates an at least connection unit in conjunction with the base fabric,Thereby,Through the flexibility of the base fabric,Bend this creation can freely,When user being allowed to dress the encapsulating structure of the chip and cloth,Do not cause the limitation of the encapsulating structure of its active receiving chip and cloth,And energy smooth what human body surface completely,When the grade chips being made to radiate far-infrared ray power,Preferably effect can be generated,In addition,The base fabric system has splendid gas permeability,System can further promote the comfort of wearing.一種晶片與布料之封裝結構，其係包含有一基布及數晶片組，且該等晶片組係透過至少一連接單元與該基布結合，藉此，透過該基布的撓曲性，使本創作可自由撓曲，讓使用者穿戴該晶片與布料之封裝結構時，不致使其活動受該晶片與布料之封裝結構之限制，且能完全平貼於人體表面，使該等晶片放射遠紅外線能量時，能產生較佳之效果，另，該基布係具有極佳的透氣性，係可進一步提升穿戴的舒適性。
