ELECTRONIC COMPONENT DEVICE, METHOD OF MOUNTING ELECTRONIC COMPONENT DEVICE ON CIRCUIT BOARD, AND MOUNTING STRUCTURE OF ELECTRONIC COMPONENT DEVICE ON CIRCUIT BOARD
An electronic component device includes a mount substrate including an outer electrode on one principal surface and a mount electrode on another principal surface, at least one substrate component including a terminal electrode on one principal surface, and that is mounted on the mount substrate by joining the terminal electrode to the mount electrode, and a sealing resin layer that is provided on the mount substrate on which the at least one substrate component is mounted. The sealing resin layer includes a region with a large thickness, and a top surface including an inclination.
