A polyolefin resin composition for hot melt adhesives includes 5 to 95% by weight of (A) an ethylene-α-olefin copolymer having a melting point of at least 100° C. but not more than 140° C.; and 5 to 95% by weight of (B) an ethylene-α-olefin copolymer having a melting point of at least 70° C. but less than 100° C.