A laminating adhesive composition comprising a) an aqueous dispersion of thermoplastic polymer particles imbibed with an epoxy compound wherein the concentration of the epoxy compound is from 1 weight percent to 40 weight percent, based on the total weight of the solid content of the aqueous dispersion; and b) at least one water emulsifiable or water dispersible epoxy curing agent selected from polyamines, polyamides, amidoamines, carboxylic functional polyesters, anhydrides, mercaptans, polymercaptans, cyclic amidines, and combinations thereof, is disclosed.
