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Thermal processing apparatus and thermal processing method
专利权人:
发明人:
申请号:
US20050194337
公开号:
US7381928(B2)
申请日:
2005.08.01
申请国别(地区):
美国
年份:
2008
代理人:
摘要:
A light source including a plurality of flash lamps emits flashes thereby flash-heating a semiconductor wafer held by a thermal diffuser and a hot plate. The current distance of irradiation between the thermal diffuser and the hot plate holding the semiconductor wafer and the light source is so adjusted as to attain predetermined intensity of irradiation. The distance of irradiation between the thermal diffuser and the hot plate and the light source can be changed or corrected by vertically moving the thermal diffuser and the hot plate. The thermal processing apparatus which uses the flash lamps, is thus capable of readily controlling the intensity of irradiation.
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