A method for material processing and laser processing device for material processing. The laser machining device has a laser beam source to provide a pulsed processing laser beam, a laser beam aligning unit to output couple the laser beam in the direction toward a area of material to be machined, and an emission device to emit a photosensitizer in the direction toward a surrounding area of the area of the material to be machined, wherein the emission device is connected to the aligning unit.
