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Laser device and method for machining material using laser radiation
专利权人:
Mark Bischoff
发明人:
Mark Bischoff,Dirk Mühlhoff,Mario Gerlach
申请号:
US13242185
公开号:
US08652122B2
申请日:
2011.09.23
申请国别(地区):
US
年份:
2014
代理人:
摘要:
Disclosed is a laser device for machining material, comprising a laser beam source which supplies pulsed laser radiation, and a variable deflection unit that introduces said laser radiation into the material at different, selectable points so as to create optical breakthroughs. The inventive laser device further comprises a pulse-selecting apparatus which modifies selected laser pulses of the pulsed laser radiation regarding at least one optical parameter in such a way that no more optical breakthroughs can be created using the modified laser pulses.
来源网站:
中国工程科技知识中心
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http://www.ckcest.cn/home/

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