A ceramic printed circuit board provided with a light reflection layer therein and used for LED packaging, and a preparation method therefor. The ceramic printed circuit board comprises a ceramic substrate layer (110) used for electric insulation and/or used for heat conduction/heat dissipation. The two opposite side surfaces, parallel mutually on the whole, of the ceramic substrate layer (110) are called a substrate A surface (112) and a substrate B surface (114) respectively. The side of the substrate A surface (112) is provided with an electronic circuit for fixing or welding an LED chip and/or clad copper used for heat conduction and heat dissipation. The side of the substrate B surface (114) is provided with a light reflection layer (130) used for reflecting light emitted by an LED luminophor and passing through the ceramic substrate layer (110); and the other surface of the light reflection layer (130) is directly exposed or is provided with a protection layer (160). The exposed surface of the light ref
