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RESIN COMPOSITION FOR ACOUSTIC MATCHING LAYER, CURED PRODUCT, ACOUSTIC MATCHING SHEET, ACOUSTIC WAVE PROBE, ACOUSTIC WAVE MEASURING APPARATUS, METHOD FOR MANUFACTURING ACOUSTIC WAVE PROBE, AND MATERIAL SET FOR ACOUSTIC MATCHING LAYER
专利权人:
FUJIFILM Corporation
发明人:
Yoshihiro NAKAI,Kazuhiro Hamada
申请号:
US16863096
公开号:
US20200253582A1
申请日:
2020.04.30
申请国别(地区):
US
年份:
2020
代理人:
摘要:
A resin composition, for an acoustic matching layer, that contains a binder including a resin and surface-treated metal particles; a cured product formed from the composition; an acoustic matching sheet; an acoustic wave probe; an acoustic wave measuring apparatus; a method for manufacturing an acoustic wave probe; and a material set, for an acoustic matching layer, that is suitable for preparation of the composition.
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中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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