Multi-component shared cooling systems include a chassis housing a first heat exchanger device and a second heat exchanger device. A first component such as, for example, a system processor, is housed in the chassis, includes a first thermal connection to the first heat exchanger device, and includes a second thermal connection to the second heat exchanger device. A second component such as, for example, a graphics processor, is housed in the chassis and includes a third thermal connection to the first heat exchanger device. The first heat exchanger device is configured to dissipate heat that is produced by the second component and transmitted by the third thermal connection. The second heat exchanger device is configured to dissipate the heat that is produced by the second component and transmitted by the third thermal connection, the first heat exchanger device, the first thermal connection, the first component, and the second thermal connection.
