The present invention is directed at an electrolyte (EL) for the electrolytic polishing of a metallic substrate comprising at at least one fluoride compound (F) and/or one chloride compound (CI), and at least one complexing agent (CA), wherein the electrolyte (EL) does not contain an acid compound that is not a complexing agent. Furthermore, the invention is directed at a process for the electrolytic polishing of a metallic substrate wherein the electrolyte (EL) is applied.
