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脆性材料基板の端材分離方法及び端材分離装置
专利权人:
三星ダイヤモンド工業株式会社
发明人:
太田 欣也
申请号:
JP20140092492
公开号:
JP6287548(B2)
申请日:
2014.04.28
申请国别(地区):
日本
年份:
2018
代理人:
摘要:
A method and an apparatus for separating an end portion of brittle material substrates can separate the end portion, which is arranged to form functional zones in the longitudinal direction and transversal direction, of a substrate being broken except for a resin layer. The substrate (20) is held at the end material separation stage (15). An end portion separating stage (15) having a chamber (52), a bottom plate (53) in its upper part, and an elastic plate (54), and a plurality of openings are provided in the spring plate (54) and the bottom plate (53). In addition, while keeping its upper base (20) by the opening of the elastic plate (54) to attract air. By causing the two opposing sides perpendicular thereto and the other two sides the height of mutually different frame-shaped pusher plate (47) parallel to the decrease in the substrate (20) surface, leaving the end portion of the substrate (20) around the separation. Borrowed by the technical aspect, the present invention enables to shorten the working time
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