An electronic device can comprise a first electronic module a second electronic module and a hermetic electric interconnect to hermetically couple them. The hermetic electric interconnect can comprise a bottom metal layer a bottom insulating layer, deposited on the bottom metal layer to insulate the bottom metal layer an interconnect metal layer, deposited on the bottom insulating layer, and deposited to form a bottom sealing ring and patterned to form electrical connections between contact pads, and to form a middle sealing ring a patterned top insulating layer, deposited on the interconnect metal layer to insulate the interconnect metal layer and patterned to form feedthrough holes and a top metal layer, deposited on the top insulating layer to start forming contacts by filling the feedthrough holes and patterned to complete forming contacts through the feedthrough holes, to form a separate barrier layer, and to complete forming the top sealing ring.
