An electronic device can comprise a first electronic module； a second electronic module； and a hermetic electric interconnect to hermetically couple them, The hermetic electric interconnect can comprise a bottom metal layer； a bottom insulating layer, deposited on the bottom metal layer to insulate the bottom metal layer； an interconnect metal layer, deposited on the bottom insulating layer, and deposited to form a bottom sealing ring； and patterned to form electrical connections between contact pads, and to form a middle sealing ring: a patterned top insulating layer, deposited on the interconnect metal layer to insulate the interconnect metal layer； and patterned to form feedthrough holes； and a top metal layer, deposited on the top insulating layer to start forming contacts by filling the feedthrough holes； and patterned to complete forming contacts through the feedthrough holes, to form a separate barrier layer, and to complete forming the top sealing ring.
