The purpose of the present invention is to solve conventional problems and provide a dispersion that is less likely to produce a poorly redispersible aggregate of metal nanowires in the manufacturing stage or product stage in a system for formulating metal nanowires in a dispersion solvent, that has excellent suitability for coating when making a conductive film, and that has favorable adhesion with a base material or layered resin. Provided is a metal nanowire dispersion containing metal nanowires (a) and a copolymer (d) obtained by copolymerizing a nonionic hydrophobic monomer (b) and a nonionic hydrophilic monomer (c), wherein the metal nanowire dispersion is characterized in that the copolymer (d) satisfies mass ratios (i) and (ii). (i) nonionic hydrophobic monomer (b):nonionic hydrophilic monomer (c) = 1:99 to 50:50 (ii) metal nanowires (a):copolymer (d) = 1:1 to 100:1
