CARTE DE CIRCUIT IMPRIMÉ

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专利权人:

Nitto Denko Corporation

发明人:

申请号：

EP16821124.1

公开号：

EP3322266A4

申请日:

2016.06.01

申请国别(地区):

EP

年份:

2019

代理人:

摘要：

A wired circuit board includes an insulating layer and a conductive pattern embedded in the insulating layer. The conductive pattern has an exposed surface exposed from one surface in a thickness direction of the insulating layer and the insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/